Si2 Annual Technical Forum Focuses on Semiconductor Design in the Cloud

AUSTIN, Texas–(BUSINESS WIRE)–The growing impact and productivity gains of designing semiconductors in the cloud comprise the focus the Si2 Annual Technology Forum, an online event scheduled for Friday, August 6, from 8:00 a.m. – to 10:00 a.m. Pacific Standard Time.

Registration is free. For details click here.

Silicon Integration Initiative is an R&D joint venture providing standard interoperability solutions for semiconductor design tools. Si2’s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.

AGENDA

Keynote Presentation: Silicon-to-System – Addressing Design, Verification, and Implementation Challenges with Cloud-Based Engineering

David Pellerin
Head of Worldwide Business Development
Hitech/Semiconductor
Amazon Web Services

Executive Panel Discussion: EDA-in-the-Cloud Challenges are Already Solved by Providers

Kerim Kalafala

Senior Technical Staff Member

IBM

Ramond Rodriguez

Senior Director of Strategic CAD Capabilities

Intel

Dr. Rhett Davis

Professor of Computer and Electrical Engineering

NC State University

Rajeev Jain

Senior Director of Technology

Qualcomm

Si2 Technical Coalition Updates

OpenAccess, oaScript Extensions

Marshall Tiner

Si2 Director of Production Standards

Standard Compact Models

John Ellis

Si2 President and CEO

AI/ML, Unified Power Models

Dr. Leigh Anne Clevenger

Si2 Director of OpenStandards

Special Announcement

Learn about a new Si2 industry initiative focusing on silicon-to-system design interoperability

Vic Kulkarni

Si2 Chief Strategy Officer

Annual Power of Partnerships Award

Presented to the Si2 team that has made the most significant contributions to the field of electronic design automation

Contacts

Terry Berke

[email protected]
512-917-1358

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